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OIF Q2 Technical and MA&E Committees Meeting Wraps with CEI-224G-Linear Project Launch, New CMIS White Papers and Requirements for Energy Efficient Interfaces

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Interoperability work continues in key project areas, including 1600ZR/1600ZR+ and EEI specifications

 

Fremont, Calif. – June 13, 2024 – OIF’s Q2 Technical and Market Awareness & Education (MA&E) Committees meeting, held May 7-9 in Athens, Greece, concluded with the launch of a Common Electrical I/O (CEI) CEI-224G-Linear project and the publication of two Common Management Interface Specification (CMIS) white papers.

Additionally, the Physical Layer User Group (PLUG) Working Group released a new system vendor requirements document for Energy Efficient Interfaces (EEI).

The event had robust attendance from member companies and featured discussions and debates on advancements in optical networking technology interoperability, as well as a guest speaker from ETH Zürich.

The meeting included ongoing efforts in many technical work areas, including 1600ZR/1600ZR+ and EEI, underscoring OIF’s leadership in tackling the complex challenges facing today’s high-speed optical networks.

“OIF’s commitment to interoperability standards and tackling technological challenges was evident at the Q2 meeting,” said Nathan Tracy, OIF President, and TE Connectivity. “The high attendance, start of the CEI-224G-Linear project, CMIS white papers, and the vendor requirements document for EEI, alongside David Moor’s insightful presentation on advanced transceiver design, underscore our leadership in promoting industry-wide collaboration and innovation.”

New Project

The new CEI-224G-Linear project will build on the approach of CEI-112G-Linear in terms of specification methodology. It will support 224G full linear optical modules for next-gen applications (e.g., Ethernet, Ultra Ethernet Consortium (UEC), Artificial Intelligence/Machine Learning [AI/ML]) with low power, cost/complexity and latency. The TP1/TP1a and TP4/TP4a electrical specifications will enable up to 224G full linear optical modules for Linear Pluggable Optics (LPO), co-packaged optics (CPO) and Near Package Optics (NPO), supporting next-generation application requirements.

“The CEI-224G-Linear project will represent significant progress in our technological capabilities, weaving the precision of CEI-112G-Linear with groundbreaking innovations,” said Mike Li, OIF Board Member and Intel. “By enabling 224G full linear optical modules and leveraging the advanced 224G DSP SERDES architecture and technology, this initiative is poised to redefine the landscapes of Ethernet, UEC and AI/ML applications. As we embrace lower power, cost and latency, this project is a giant step forward in next-generation computing and connectivity driven by AI/ML.”

New White Papers

Common Management Interface Specification (CMIS) White Paper on Management of Smart Optical Modules

This white paper explores how the DWDM functions, parameters and operational aspects of “smart” optical pluggable modules can be handled more efficiently to address various challenges. It introduces an alternative control paradigm for optical modules that decouples optical layer control from packet layer control and from host software and packet controller software development and outlines the pros and cons of this approach. This paradigm is called “host independent management,” enabling advanced capabilities of smart optical modules via additional management methods. The white paper is available for download here.

CMIS-Based Out-of-Band Messaging for Link Training

This white paper provides background on link training and a proposed message catalog by which any transmit SerDes can be trained initially (or tuned adaptively while in service) based on the needs of the corresponding receive SerDes, with the help of message exchange.

It promotes out-of-band (OOB) messaging via the ubiquitous CMIS management link as a flexible solution for exchanging link training messages. The technical specifications of the messaging facility and the representation of the messages will be defined in a CMIS-LT supplement. Potential CMIS-LT applications could include CEI-112G Very Short Reach (VSR), Extra Short Reach (XSR), XSR+, and Medium Reach (MR), IEEE 802.3 AUI C2M links, Fibre Channel, InfiniBand, Optical Transport Network (OTN), etc. Download the white paper here.

Requirements Document 

System Vendor Requirements Document for Energy Efficient Interfaces

In today’s fast-paced technological landscape, where data processing and communication demands for AI continue to soar, pursuing energy-efficient solutions is critical. This requirements document for EEI is a direct result of engaging with end users to understand their needs and expectations. It seeks to prioritize applications and establish fundamental criteria for the next generation of energy-efficient electrical and optical link projects and specifications.

Through these discussions, it’s clear the most pressing need for EEI is in high-density application scenarios. The document outlines critical requirements to achieve optimal performance for various applications that necessitate the utilization of such interfaces. These requirements encompass a range of factors, including energy targets, latency targets, desired form factors, degrees of interoperability, traffic types and more. 

Download the requirements document here.

Guest Speaker

The event was further highlighted by guest speaker David Moor, a representative from ETH Zürich and the FLEX-SCALE consortium. Moor discussed the development of an optical digital-to-analog converter (oDAC) supporting Tbps+ data rates with lower power per bit than conventional modulation methods. According to Moor, this design utilizes currently available electronics and photonic devices and is well suited to support high-capacity transport with improved power efficiency.

For more information about the OIF and to access the latest white papers, please visit OIF’s website.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Launches 800G Coherent and Co-Packaging Framework IA Projects, Elects New Board Members/Positions, Officers and Working Group Chairs

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Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of two new projects –  800G Coherent and Co-Packaging Framework, availability of a new FlexE for 400ZR white paper, newly elected board members/positions and working group representatives. These activities and elections took place at the Q420 Technical and MA&E Committee meetings held virtually November 2-November 6, 2020.

New Projects

800G Coherent

In scope for the 800G Coherent project is to define interoperable 800G coherent line specifications for campus and DCI applications. The resulting Implementation Agreement (IA) will:

  • Define single-lambda 800G coherent line interfaces for two applications
    • Amplified, single span, DWDM links up to 80-120km
    • Unamplified, fixed wavelength links of 2-10km
  • Support Ethernet client(s) (minimum 100GE) up to 800G aggregate bandwidth

“The next standardized coherent rate beyond 400ZR will be technically challenging with many factors to be considered,” said Tad Hofmeister, Technical Lead, Optical Networking Technologies at Google and OIF Vice President. “With the 800G Coherent IA, OIF is in a unique position to take a leadership role in defining interoperable 800G coherent line interfaces for various applications.”

Co-Packaging Framework IA

The Co-Packaging Framework IA, announced on November 10, 2020, will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

White Paper

A new OIF white paper addressing 400ZR applications requiring multiplexing of lower rate Ethernet signals (e.g. 100GE) and how to leverage FlexE for this service multiplexing is now available.

The OIF 400ZR IA includes mapping of 400G Ethernet signals as defined in IEEE 802.3, but not lower rate services such as 100G Ethernet. This white paper describes utilizing the OIF FlexE Implementation Agreement multiplexing of lower service rates, such as 100G and 200G Ethernet to a 400G frame that can be carried by 400ZR devices. Example profiles are provided to guide interoperability in common scenarios.

Election Results

  • Board of Directors:
    • Ian Betty, Ciena, continues to serve on the Board and was appointed as President
    • Mark Filer, Microsoft, was elected to the Board (two-year term)
    • Tad Hofmeister, Google, continues to serve on the Board and was re-appointed as Vice President
    • Mike Li, Intel, was re-elected to the Board (one-year term)
    • Jeffery Maki, Juniper Networks, was elected to the Board (one-year term)
    • Gary Nicholl, Cisco, was re-elected to the Board (two-year term) and appointed as Secretary/Treasurer
    • Nathan Tracy, TE Connectivity, was re-elected to the Board (two-year term) and appointed as VP of Marketing
  • Officers:
    • Klaus-Holger Otto, Nokia, was elected as Technical Committee Chair
    • Karl Bois, Hewlett Packard Enterprise, was elected as Technical Committee Vice Chair
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Richard Ward, Intel, was elected as Market Awareness & Education Committee Co-Chair, Physical and Link Layer
    • Dave Brown, Nokia, continues to serve as Director of Communications
  • Technical Committee:
    • Michael Klempa, Amphenol, was elected as Physical and Link Layer Interoperability Working Group Chair (two-year term)
    • Jeffery Maki, Juniper Networks, was re-elected as Physical Layer User Group Working Group Chair (two-year term)

“I’m looking forward to serving OIF members as president of this vital organization and thank all those who have served and continue to serve,” said Ian Betty, Ciena and new OIF president. “OIF’s role continues to be critical in making great strides in interoperability solutions for today’s and tomorrow’s challenges. Congratulations to the entire board and those appointed to leadership positions – your role is integral to OIF’s continued success.”
 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010