OIF Interoperability 2013 – Enabling the Next Generation of 100G Architectures

ECOC 2013 – September 23-25, 2013 – London, England

The demonstration addressed multiple technologies including CEI-28G-VSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25G-LR backplane applications and module thermal specifications that enable 100G capabilities.

The following companies participated:

Amphenol

Applied Micro

Cisco

Finisar

Fujitsu Optical Components

Inphi

Molex

MoSys

Semtech

TE Connectivity

Xilinx.

Test Equipment used in the demonstration was provided by Agilent Technologies Inc. and Tektronix, Inc.

OIF Interoperability 2013 White Paper
Multi-Vendor Interoperability Testing of CFP2, CPAK and QSFP28 with CEI-28G-VSR and CEI-25G-LR Interface During ECOC 2013 Exhibition

September 11, 2013 – OIF To Showcase Record Number of Interoperability Demonstrations at ECOC 2013
Wide Range of Technologies Support Next-Gen 100G and 400G Architectures
as reported by MarketWatch