March 7-9, 2023
San Diego Convention Center
San Diego, CA
Booth #5101
OIF Hosts Largest Ever Multi-Vendor Interoperability Demonstration of the Critical Solutions Accelerating Implementation of Next-Generation Capabilities at OFC 2023; Celebrates 25 Years of Interoperability Work
OIF hosted its largest ever demonstration of multi-vendor interoperability at this year’s OFC 2023, March 7-9 in San Diego, CA, featuring four fundamental technology areas – 400ZR optics; Co-Packaging architectures; Common Electrical I/O (CEI) channels; and Common Management Interface Specification (CMIS) implementations. The work of OIF and its members is critical in accelerating the adoption of technologies enabling the network of today and the future. The interoperability demos were both live and static at OIF’s booth, #5101.
The live and static interoperable optical networking solutions demo at OFC featured 34 OIF member companies: ADVA; Alphawave Semi; Amphenol; Astera Labs; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; ColorChip Group; EXFO; InnoLight Technology; Juniper Networks; Keysight Technologies; Lumentum; MACOM Technology Solutions Inc.; Marvell; Microchip Technology; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec, and Wilder Technologies.
Demo Participant Material
Interoperability Demo Presentations
- OIF 400ZR Interoperability Demo Presentation
- OIF CEI-112G and CEI-224G Interoperability Demos Presentation
- OIF CMIS Interoperability Demo Presentation
- OIF Co-Packaging Interoperability Demo Presentation
Technology Showcase
Wednesday, March 8, 2023
Dynamic session with Stephen Hardy, editorial director of Lightwave, and a panel of industry analysts and OIF experts discussed how OIF has helped bring order to a chaotic marketplace over the past 25 years and debated the challenges ahead for OIF and the optical networking industry.
– How OIF’s member-driven model leverages collaboration and consensus to solve complex industry challenges
– What current and trending challenges are in play
Panelists:
Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Vladimir Kozlov, Founder and CEO, LightCounting
Sterling Perrin, Senior Principal Analyst, Optical Networks and Transport, Heavy Reading
Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, PLL; Technologist, System Architecture Team, TE Connectivity
Alan Weckel, Founder and Technology Analyst, 650 Group
Celebration Reception – Wednesday, March 8 – 4pm-5pm PT – OIF booth #5101
Show Floor Programs
Wednesday, March 8, 2023
OIF Panel – “Defining 800ZR and 800LR; An OIF Update”
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Panelists: Josef Berger, Associate Vice President, Optical and Copper Connectivity Group, Marvell; Sebastien Gareau, Systems Architect, Ciena; Scott Wilkinson, Lead Analyst, Network Components at Cignal AI; Tom Williams, Director of Technical Marketing, Cisco Systems
800ZR and 800 LR Panel Presentations:
Josef Berger, Marvell
Sebastien Gareau, Ciena
Scott Wilkinson, Cignal AI – click here to download
Tom Williams, Cisco Systems
Thursday, March 9, 2023
OIF Panel – “Enabling Next Generation Co-Packaging Solutions”
Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Co-Packaging Vice Chair and Board Member; CTO Office, Ranovus
Panelists: Jeff Hutchins; Kenneth Jackson, Product Marketing Director, Sumitomo Electric Device Innovations, USA; Yi Tang, Principal Hardware Engineer, Cisco; Nathan Tracy, OIF MA&E Committee Co-Chair, PLL; Technologist, System Architecture Team, TE Connectivity; Richard Ward, Chief Technologist Data Connectivity, Astera Labs
Click HERE for Co-Packaging Panel Presentations
Press Release
Educational White Paper
OIF 400ZR Interoperability OFC 2023 Plugfest (February 2023)