As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224 Gbps per lane, new specifications and technologies will be required.
OIF developed a framework document that identified the hardware interconnection application spaces where the communications and computer industries could benefit from interconnection definitions or Implementation Agreements (IA).
The CEI-224G framework project resulted in a white paper summarizing the consensus findings and guidance for new OIF project starts for future CEI clauses addressing specific 224 Gbps reaches and architectures.
In early 2022, OIF launched four new CEI projects: CEI-224G-Extra Short Reach (XSR) Common Electrical On-Package Interface Project, CEI-224G-Very Short Reach (VSR) Common Electrical Chip-to-Module Interface Project, CEI-224G-Medium Reach (MR) Common Electrical Chip-to-Chip Interface Project, and CEI-224G-Long Reach (LR) Common Electrical Backplane and Copper Cable Interface Project. These projects are the first set to target the 224G generation of electrical interfaces.
Projects
Common Electrical I/O – 224G-XSR
This project will develop IA specifications for die-to-die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support 224G I/O links with significantly reduced power, complexity, and enhanced throughput density.
Common Electrical I/O – 224G-Very Short Reach
This project will develop IA specifications for chip-to-module (C2M) interface which can be used to support optical modules (e.g., 200G, 400G, 800G and 1600G) with reduced power, complexity and enhanced density.
Common Electrical I/O – 224G-MR
This project will develop and produce an implementation agreement for a Medium Reach electrical interface operating @144 to 232Gbps signaling over up to 500 mm of PCB and up to one connector.
Common Electrical I/O – 224G-LR
This project will develop and produce an implementation agreement for a Long Reach electrical backplane interface operating @144 to 232 Gbps signaling over up to 1000 mm of backplane and up to two connectors.
Click here for OIF’s CEI-112G project information.
Press Releases
- September 5, 2024 – OIF Leads the Charge for Interoperability at ECOC 2024
- August 28, 2024 – OIF Concludes Successful Q3 ‘24 Technical and MA&E Committees Meeting with Launch of Three New Projects to Advance Networking Technologies
- August 7, 2024 – OIF Champions Interoperability at ECOC 2024: 34 Member Companies to Showcase Solutions for Data Centers, AI/ML Technologies and Disaggregated Systems
- June 13, 2024 – OIF Q2 Technical and MA&E Committees Meeting Wraps with CEI-224G-Linear Project Launch, New CMIS White Papers and Requirements for Energy Efficient Interfaces
- March 6, 2024 – OIF to Take Center Stage at OFC 2024 with Groundbreaking Multi-Vendor Interoperability Demonstrations and Expert Panels
- February 7, 2024 – OIF to Showcase Interoperability at OFC 2024 with Nearly 50 Member Companies Collaborating to Address Unprecedented Demand for Next-Generation Network Solutions
- January 10, 2024 – OIF Experts to Provide Technology Updates on Power Consumption in Next Generation Optical AI Networking, Common Electrical I/O (CEI) Trends at DesignCon 2024
- September 20, 2023 – OIF Showcases Multi-vendor Interoperability at ECOC 2023: Demo Features Nearly 40 Companies Demonstrating Innovation Across 400ZR+, Co-Packaging, CEI-112G & CEI-224G and CMIS
- September 8, 2023 – OIF’s Q3 Technical and MA&E Committees Meeting Spurs Four New Innovative Projects – Link Training for 224G Electrical Interfaces, 1600ZR, Data Center/Optical Network Coordination, Energy Efficient Interfaces
- August 9, 2023 – OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities
- May 22, 2023 – OIF to Showcase 25 Years of Driving Optical Networking Transformation at NGON & 5G Transport 2023, Hosts Sessions on Interoperability Advancements in 800LR/ZR, 400ZR, CEI, CMIS and Co-Packaging
- February 22, 2023 – OIF Highlights 400ZR, Co-Packaging Architectures, CEI-112G & CEI-224G and CMIS Implementations Interoperability Among 30+ Global Companies; Hosts Special Anniversary Events at OFC 2023
- January 25, 2023 – OIF Hosts Largest Ever Multi-Vendor Interoperability Demonstration of the Solutions Accelerating Next-Generation Capabilities at OFC 2023; Celebrates 25 Years of Interoperability Work
- January 11, 2023 – OIF to Update Industry on Next-Generation Electrical and Optical Interface Projects, including 224 Gbps & Co-Packaging, at DesignCon 2023
- September 7, 2022 – OIF Members to Showcase Multivendor Interoperability for Critical Networking Technologies at ECOC 2022
- June 7, 2021 – OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences
- August 26, 2020 – OIF Approves CEI-224G Development Project, Reviews Co-packaging of Optics with ASICs Workshop, Announces Optical Module Management Interface Survey Results at Q3 Meeting
Demos
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Webinar
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- June 18, 2020 – Cu (see you) Beyond 112 Gbps, in partnership with Lightwave This event is now available for on demand viewing here.
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For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at technicalquestions@oiforum.com.
For information on other OIF current projects, please see OIF Current WorkFor public OIF Implementation Agreements, please see Implementation Agreements (IAs)
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