Come and Join us!
OIF Physical & Link Layer Working Group Electrical Interim Meeting
November 6, 2023 – Osaka, Japan
Hybrid meeting* for members only.
OIF Q4 2023 Technical and Market Awareness & Education Committees Meeting
November 7-9, 2023 – Osaka, Japan
Hybrid meeting* for members only.
*Hybrid Meeting: – A hybrid meeting accommodates active and equal participation by in-person and remote attendees – In-person and remote attendees will participate via Webex. The quarterly meeting will follow the traditional in-person schedule, in the local time zone of the meeting venue, Tuesday through Thursday. The PLL WG Electrical Interim Meeting will be held on the Monday adjacent to the Q423 TC Meeting.
For details on OIF Speaking Engagements, click HERE
NGON & 5G Transport 
May 30-June 1, 2023 – Cote d’Azur, France
Tuesday, May 30, 2023
OIF Workshop – “OIF: Bringing Order to Chaos”
Presenters: Dave Brown, OIF Dir of Communications, Nokia and Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Wednesday, May 31, 2023
OIF Panel – “IP-Optical with Coherent Optics”
Panelists: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair; Edward Echeverry, Telefonica; Ian Redpath, Omdia
OIF @ OFC 2023
March 7-9, 2023 – San Diego, CA
OIF Technology Showcase – “Bringing Order to Chaos – OIF” – Wednesday, March 8 at 3pm PT, Theater 3
One hour session with OIF leadership: Karl Gass, OIF; Nathan Tracy, OIF, TE Connectivity and special guests: Stephen Hardy, Lightwave; Vlad Koslov, LightCounting; Sterling Perrin, Heavy Reading; Alan Weckel, 650 Group
CELEBRATION RECEPTION at OIF Booth #5101 – Wednesday, March 8 at 4pm PT
Show Floor Panel Sessions
“Defining 800ZR and 800LR; An OIF Update” – Wednesday, March 8 at 1pm PT, Theater 2
- Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
- Panelists: Josef Berger, Marvell; Sebastien Gareau, Ciena; Scott Wilkinson, Cignal AI; Tom Williams, Cisco Systems
Presentations:
Sebastien Gareau, Ciena
Scott Wilkinson, Cignal AI – click here to download
Tom Williams, Cisco Systems
“Enabling Next Generation Co-Packaging Solutions” – Thursday, March 9 at 12:15pm PT, Theater 2
- Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Co-Packaging Vice Chair and Board Member, Ranovus
- Panelists: Kenneth Jackson, Sumitomo Electric Device Innovations; Jeff Hutchins; Yi Tang, Cisco; Nathan Tracy, OIF MA&E Committee Co-Chair, Physical & Link Layer and TE Connectivity; Richard Ward, Astera Labs
OIF Q1 2023 Technical and Market Awareness & Education Committees Meeting
January 10-12, 2023 – Indian Wells, CA
Hybrid meeting for members only.
Guest Speakers!
Vlad Koslov, LightCounting – Tuesday, January 10
Alan Weckel, 650 Group – Wednesday, January 11
Member Reception Celebration – Tuesday, January 10
